Audio Sub-Assembly

Stetron’s engineering team is capable of developing enclosure solutions of various types such as ported, sealed, and passive radiator builds for audio sub-assembly. Software simulations and rapid prototyping using 3D printers and CNC machines are utilized to quickly develop a proof of concept design that meets every audio requirement.

To optimize all manufacturing functions, we conduct a full DFM review before transitioning into production. Our agile approach to product development and manufacturing assures that our clients receive the best cost at the quickest turnaround.

Contact Us to review your specific requirements.

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